Cadence Janus NoC enables design teams to achieve better PPA faster and with lower risk, freeing up valuable engineering resources for SoC differentiation -- Cadence Design Systems, Inc. (N...
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- Siemens Digital Industries Software today introduced Calibre® 3DThermal, innovative software for thermal analysis, verification and debugging in 3D integrated circuits (3D-ICs). Calibre...
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Resilient to advanced cyber-attacks - SCA, FIA, DPA, SIFA; No pre/post-processing data; enhanced performance and area - FortifyIQ, a leading provider of advanced security semiconductor solu...
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Combining IP from two RISC-V leaders with an independently developed NPU brings advanced AI acceleration and rich user interfaces to ESWIN Computing’s EIC77 Series SoCs. -- Today, B...
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SiFive is seeing growing adoption, with more than two billion SiFive RISC-V based chips already in the market – Today SiFive, Inc. the gold standard for RISC-V computing, is unveili...
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By Sally Ward-Foxton, EETimes (June 25, 2024) SANTA CLARA, Calif. — Tenstorrent’s first generation AI chips will soon come in a workstation format for AI developers, the comp...
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Barcelona, Spain – June 25, 2024 -- Semidynamics, the European RISC-V custom core AI specialist, has announced Tensor Unit efficiency data for its ‘All-In-One’ AI IP runni...
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– CEA-Leti is proud to announce the kick-off meeting today of the FAMES Pilot Line, a pioneering project aimed at advancing semiconductor technologies in Europe. This initiative aligns...
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Flex Logix is the leading provider of eFPGA IP/SW and has the best AI/DSP IP/SW Flex Logix® Technologies, Inc ., the leading supplier of embedded FPGA (eFPGA) IP and reconfigurable DSP/...
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Efabless Corporation, the creator platform for chips, is excited to announce that it has enabled 40 new companies to design chips.
While governments worldwide are investing billions of do...
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– Comcores, a leading supplier of Ethernet-based IP solutions as well as an innovator in 5G wireless and Time-Sensitive Networking (TSN) solutions, announces the availability of its c...
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First cloud-based NoC design tool now available at iNoCulator.ai -- SignatureIP, the pioneer of next generation interconnect and interface solutions, announces early access availability of it...
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-- Siemens Digital Industries Software announced today Innovator3D IC™, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and c...
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Will also Showcase High-performance PLL, DLL and DDR PHY IP Who True Circuits, Inc. (TCI), a leading provider of analog and mixed-signal intellectual property (IP) for the semiconductor, sy...
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Crypto Quantique, a leading provider of quantum-driven security for IoT and ZARIOT , an award-winning cellular IoT connectivity provider, have partnered with leading eSIM vendor, Kigen . T...
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Crypto Quantique, a provider of quantum-driven security for IoT and ZARIOT, a cellular IoT connectivity provider, have partnered with the eSIM vendor, Kigen. This partnership is to implemen...
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In a leap towards revolutionizing quantum computing and enhancing the energy efficiency of data centers, Semiwise, sureCore, and Cadence have collaborated to overcome critical challenges in ...
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June 13, 2024 – Helsinki – Flow Computing Oy - the pioneer in licensing on-die ultra-high-performance parallel computing solutions to CPU vendors of all architectures – ...
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Siemens' NX X for cloud enabled computer-aided design (CAD) will help Dovetail develop the propulsion systems and engines by teams in Spain and Australia Siemens Digital Industries Software a...
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Cadence verification and RTL-to-GDS digital full-flow tuned for automotive safety, quality and reliability requirements -- At embedded world 2024, Cadence and Dream Chip demonstrated Dream...
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Collaboration enables Primemas to integrate the Achronix Speedcore eFPGA IP into its SoC Hublet product line, providing a scalable, feature-rich chiplet platform -- Achronix, a leader in h...
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Company's new process signals transition toward foundry service provider Last week at VLSI Symposium, Intel detailed the manufacturing process that will form the foundation of its foundry...
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On June 25, the French CEA-Leti Institute officially announced that it would take the lead in building the FD-SOI pilot line code-named FAMES. The total investment in the project is 830 mill...
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