D&R News Alert
March 27th, 2025
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Welcome to the issue of March 27th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Foundry News
■ Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
■ TSMC Reportedly Speeds Up AP7 and AP8 Build-Outs, Targets Doubling SoIC Capacity
Dolphin Design
 Save Power with Meerkat, the Silicon Telemetry Solution
• Power reduction > 15% vs standard regulation schemes
• Reliability enhancement thanks to reduced aging effects
• Safety improvement via ultra-fast protection mechanisms

Learn More >>

Design Platforms and Services
■ Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
■ EnSilica Opens Second Brazilian Design Centre Following Multimillion Pound Design and Manufacturing Contract Win
RISC-V
■ Hong Kong investment arm backs Chinese RISC-V start-up StarFive in tech push
Siemens Webinar, 1st April | Introduction to Tessent UltraSight-V, on-chip debug & trace solution for RISC-V

• Empowers development of high-performance embedded software
• Minimises debugging delays & accelerate SoC projects
• Highly compressed processor trace (RISC-V E-Trace spec)
• Scalable to a complete SoC system level debug, optimization & monitoring solution
Register now : Europe | 10am BST - USA | 9am PDT

Artificial Intelligence
■ Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
■ Fraunhofer to show AI, robotics and connected data for healthcare
■ AI platform enables customisable packaging solutions for AI applications
Design Partner of the Week
IP Core Worx
IP Core Worx’ robust and dependable IP suite
• Wireless Communication and FEC
• DVB and Digital signal processing
• Custom designed cores
Learn more >>

Automotive
■ M31 Technology - AI-Powered Automotive Dual Engines and 2nm Technology Boost Revenue to Record Highs
■ Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design
■ Cadence Silicon Success of UCIe IP on Samsung Foundry's 5nm Automotive Process - By Cadence
■ Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications
Products
 ❖ M31 eUSB2 PHY IP (2nm, 3nm, 4nm, 5nm, 6nm, 7nm, 28nm)

Channel Sounding Bluetooth® V6.0 RF IP for your next IOT SoC
• BLE & BT RF Transceiver IP – Silicon-proven in 22nm & 40nm
• Pre-Integrated with CEVA & Mindtree's Bluetooth Controller IP
• High-Precision Spatial Awareness via RF Sensing
• RF IP Specialists: BLE, BT, WiFi, BT+Wifi, GNSS, SatCom, Cellular

Audio and Video IP
■ intoPIX JPEG XS Cores Power Delta Video's IP Video Transmission Solutions
■ SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
What’s new in FDSOI?
Products
 ❖ intoPIX TICO A JPEG XS solution

Internet of Things
■ Embedded World, Nuremberg: Nordic Semiconductor’s Strategy for Secure and Efficient IoT Connectivity
FPGA
■ PolarFire® SoC FPGAs Achieve AEC-Q100 Qualification
Green Electronics
■ Recycling Critical Materials from E-Waste for a Circular Economy
Partner News
■ EnSilica Agrees a Multimillion Pound Design and Manufacturing Services Contract
■ Silvaco Announces Departure of Chief Financial Officer
Business News
■ Spanish government invests €13.8m in 5G satellites





New IP
• RT-7xx CryptoManager Root of Trust by Rambus
• CXL 3 Controller by Logic Fruit Technologies
• PCIe 4.0 PHY IP for SS 14LPU by Synopsys
• TSMC FPD-Link / OpenLDI / LVDS forwarded clock SERDES Link by Silicon Creations
• On-Chip IO to Core Voltage Buck Regulator by Obsidian Technology

What they said at
IP SoC EU 24

From silicon to the use cases, SOIL as a test bench for automotive applications
Leonardo Govoni, AED Vantage GmbH

Designing SOC with ABX® - Challenges and Solutions
Florian Bilstein, Director Design Service, Racyics GmbH

Wireless and Batteryless Interface for IoT
Polina Proskurova, Project Manager, NTLab

How to select the best Audio codec architecture to enhance your wearables?
Etienne Faucher, Product Marketing Manager, Dolphin Semiconductor

Porting ASIC IP Cores to FPGA: It's Not a Cakewalk!
Philipp Jacobsohn, Principal Application Engineer, SmartDV Technologies

Integrated Security Solutions: How SRAM-based PUF Augments Embedded Hardware Secure Modules in a Post-Quantum World
Erik van der Sluis, Principal R&D Engineer, Synopsys, Inc.

How to Enhance Energy Efficiency and Reduce Costs with Advanced In-Situ Sensors?
Vincent Telandro, Product Marketing Manager, Dolphin Semiconductor

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