D&R News Alert
October 10th, 2024
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Welcome to the issue of October 10th, 2024 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

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Foundry and Packaging
■ Intel, TSMC to detail 2nm processes at IEDM
■ Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
Technology News
■ Accelerating Europe’s Photonics Lab-to-Fab Journey
Verification IP and Test Suites for UCIe, CXL, PCIe, and Memories
Synopsys • System solutions for AI/HPC, Automotive, and Mobile applications
• Available for simulation, emulation, and prototyping
 Learn more >>

Chiplet
■ Revolutionizing High-Performance Silicon: Alphawave Semi and Arm Unite on Next-Gen Chiplets
■ Why Chiplets Are the Next Big Innovation in Silicon
Ncore Cache Coherent Interconnect IP
Accelerate leading-edge SoC designs with Ncore™. Save upwards of 50 person-years of effort per project with Arteris IP.

■ Any processor   ■ Multiple protocols   ■ Flexible configuration
Learn about Ncore Download tech paper Watch video

RISC-V
■ Debug and Trace Support for Synopsys ARC-V Processor IP
■ LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
■ Intel Architects Start RISC-V Business with AheadComputing
Processor IP
■ First Major Toolbox for MATLAB/Simulink Model Deployment to Tensilica HiFi DSPs
■ Deeptech Keysom completes a €4M fundraising and deploys the first “no-code” tool dedicated to the design of tailor-made processors
Security
■ Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
Secure-IC
Secure-IC
[NEW] Securyzr™ neo Core Platform –
Versatile solution with optimized PPA
  • High performance and configurability with a significantly smaller footprint
  • Faster time-to-market thanks to C model and emulation
  • One platform fitting diverse market security needs: IoT, Automotive, mobile, AI
  • Certification-ready: PSA, EVITA, SESIP, CMVP / FIPS 140-3, CC, OSCCA...
>> LEARN MORE                      >> Ask for a trial

Automotive
■ Xylon's Updated logiHSSL IP Core Seamlessly Connects Infineon AURIX Microcontrollers with AMD Adaptive SoCs and FPGAs
■ OPENEDGES Technology Achieves ISO 26262 ASIL-B Certification
■ MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A‑PHY Automotive SerDes Specification
■ The Future of Driving: How Advanced DSP is Shaping Car Infotainment Systems by Cadence Design Systems
Artificial Intelligence
■ Efabless Unveils New Custom Chip Platform Designed for Edge ML Products
CEVA Ceva-NeuPro-M NPU IP Family for Generative & Classic AI
  • Highest power efficiency AI processing for smart edge devices
  • Up to 7K Token-per-Second/Watt for a Llama 2 7B model
  • Up to 256 TOPS per core and fully scalable to reach above 1200 TOPS
  • Future proof using a programmable VPU to ensure support of new layers
Learn more >>>

IoT
■ Silicon Labs and Kudelski IoT Partner to Accelerate Matter Device Certification
Security Solution
■ Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technology in MCUs and SoCs
Partner News
■ Rambus to Announce Third Quarter Fiscal Year 2024 Results
Business News
■ Significant EU funding for VTT's semiconductor development – supporting the growth of the semiconductor industry
■ How Poland became key to Europe’s semiconductor sovereignty
IP SoC Conference 2024
December 10th - 11th, 2024 		Submission Open >>







What they said at
IP SoC Japan 24

Enabling Multimodal AI on Edge Devices
Shanghung Lin, VP, Vision and Image Product, Verisilicon

Quantum Safe Cryptography: Protecting Devices and Data in the Quantum Era
Toru Furukawa, Senior Field Application Engineer, Rambus, Inc.

Future-Proof Your Design with Hardware-Based Post-Quantum Cryptographic IP Cores
Dr. Matti Tommiska, Xiphera Ltd

Security From Chip-To-Cloud with PQC (Post Quantum Cryptography)
Ahmed BOUGRIANE, Pre-Sales Engineer North Asia, Secure-IC

How SafeIP(TM) enables fail operational vehicles, robotics and drones
Benjamin Weinhardt, Head of Business & Collaboration, Siliconally GmbH

Video Codecs Landscape and Challenges Ahead
Yujing Wei, VP, APAC Business Development, Allegro DVT

Interview with Dr. Matti Tommiska, Xiphera Ltd

Interview with Long Liu, Account Manager, Key ASIC

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