64Gbps Universal chiplet boosts interconnect data rates

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ept.ca, Dec. 30, 2024 – 

ALPHAWAVE SEMI 64 Gbps Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP Subsystem delivers high chiplet interconnect data rates, setting a new standard for ultra-high-performance D2D connectivity solutions. The third generation, 64 Gbps IP Subsystem builds on the successes of the most recent Gen2 36 Gbps IP subsystem and silicon-proven Gen1 24 Gbps and is available in TSMC's 3nm Technology for both Standard and Advanced packaging. The Gen3 64 Gbps UCIe IP delivers a bandwidth density of over 20 Tbps/mm, with ultra-low power and latency. Solution is highly configurable supporting multiple protocols, including AXI-4, AXI-S, CXS, CHI and CHI-C2C to address the growing demands for high-performance connectivity across disaggregated systems in High-Performance Computing (HPC), data centres and artificial intelligence (AI) applications.

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