Siemens presents next-generation AI-supported software for electronic system design

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eejournal.com, Nov. 15, 2024 – 

• The latest version combines Xpedition, Hyperlynx and PADS Professional software through a unified user experience with connectivity and collaboration in the cloud

• Improved integration with Teamcenter and NX software from Siemens

Siemens Digital Industries Software today announced the latest evolution of its electronic systems design portfolio. The next generation takes an integrated and multidisciplinary approach, combining Xpedition™, Hyperlynx™ and PADS™ Professional software into a unified user experience with cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design.

The electronics design industry is facing major challenges. Skilled engineering shortages, supply chain uncertainties and increasing design complexity are impacting engineers and overall product development, preventing them from meeting the demands of modern electronics development.

Siemens' next-generation electronic system design solution addresses these challenges head-on by providing an intuitive, AI-powered, integrated, secure and cloud-connected solution to equip engineers and businesses with the right tools in this dynamic environment.

"We are excited to announce the launch of our next-generation electronic system design solution, tailored to the acute needs of today's electronics designers in particular and the development community in general," said AJ Incorvaia, Senior Vice President, Electronic Board Systems, Siemens Digital Industries Software. "We have taken great care in this release and incorporated feedback from hundreds of participants. By unifying the Xpedition, HyperLynx and PADS Pro environments and integrating them with AI, our customers are well equipped to address their challenges."

The next-generation toolset is designed to provide highly intuitive tools to address the skills shortage and enable engineers to adapt quickly with minimal learning curves. It offers predictive engineering and novel AI support, improving engineers' skills and streamlining and optimizing their workflows. Cloud connectivity facilitates collaboration across the value chain and provides access to specialized services and resources, enabling engineers to quickly adapt to changing requirements and gain insight into the supply chain, and making it easier to collaborate with stakeholders regardless of location.

An integrated and multidisciplinary approach is essential to maximize efficiency and productivity. Siemens' next-generation solution will facilitate the seamless flow of data and information across the entire product lifecycle using digital threads. This integration promotes collaboration, improves informed decisions and optimizes designs.

"We are excited to be working with Siemens and to be an active user in the development of this next-generation toolset," says Tom Pitchforth, Vice President of Electronics Engineering at Leonardo. "Siemens has been a key partner for us for over 20 years and it is imperative that our toolset providers align with our future needs, especially in a rapidly changing and complex landscape. Our key objectives in leveraging the new toolset capabilities include strategic goals, such as organizational agility, and tactical goals, such as reaching the productivity phase faster.

The next-generation software also offers improved integration with Siemens' Teamcenter® product lifecycle management software and NX™ product engineering software, enabling multi-BOM support and closer collaboration between ECAD and MCAD domains. For increased security, the software offers rigid data access restrictions that can be configured and geolocated, while applying the most stringent industry protocols. Siemens has partnerships with industry-leading cloud providers to ensure robust security measures. In addition, the solution includes management capabilities for design and verification requirements for model-based system development.

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