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Samsung Partners with TSMC, Its Foundry Rival, on HBM4 Development
www.trendforce.com, Sept. 06, 2024 –
No eternal allies. No perpetual enemies. The old proverb seems so true when it comes to the semiconductor industry, when the world's top foundry, TSMC, announced the collaboration with its rival Samsung, the second largest foundry globally, on the development of HBM4, according to the reports by Korean media outlets the Korea Economic Daily and Business Korea. According to analysts cited by the Korea Economic Daily, it would mark their first partnership in the AI chip sector.
Citing the remarks of Lee Jung-bae, Head of the Memory Business Division at Samsung Electronics at SEMICON Taiwan, the reports note that in order to advance in HBM, Samsung is preparing over 20 customized solutions in collaboration with various foundry partners. However, Lee declined to comment on which specific foundry they were partnering with.
The answer has been revealed when on September 5th, Dan Kochpatcharin, Head of Ecosystem and Alliance Management at TSMC, confirmed that the two companies are working together on developing a buffer-less HBM4 chip.
According to Business Korea, buffer-less HBM is a product that eliminates the buffer used to prevent electrical issues and manage voltage distribution, which Samsung targets to introduce with HBM4. The innovation is expected to enhance power efficiency by 40% and reduce latency by 10% compared to existing models.
The reports note that the main consideration Samsung chooses to team up with TSMC would be the attempt to incorporate customized features requested by major clients like NVIDIA and Google.
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