FlexE IP - A New flexible Ethernet client interface standard

Vasan Karighattam, VP of Engineering, SoC and SSW, Open Silicon, USA

Biography :

Vasan Karighattam is Vice President of Engineering at Open-Silicon, responsible for architecture, IP, SoC design and verification, as well as system software and post-silicon validation. Prior to Open-Silicon, Vasan led the development of next-generation architectures of MDSL / HDSL transceivers and service framers, and was a key participant in the standards activity for the IEEE 802.17 Resilient Packet Ring MAC in the Optical Components group at Intel Corporation. He also worked for several years on next-generation architecture and front-end development of SoCs for tablets and smart phones. Vasan’s 25 years of semiconductor engineering experience also includes positions at Level One Communications, LSI Logic, Acuson Corporation and Protocol Engines. Vasan holds a master’s degree from Michigan Technological University at Houghton and a bachelor’s degree from Bangalore University.