Chiplet and Die-to-Die Interface Interoperability - how to accelerate path to a real Open Ecosystem
Letizia Giuliano - Vice President Solution Engineering - Alphawave Semi
Biography :

Letizia Giuliano is VP Solutions Engineering at Alphawave IP, where she is responsible for architecting solutions for SoC customers and technical marketing for high-speed interfaces and chiplet design. She focuses on high-speed connectivity IPs, easy SoC integration, and proactively building new methodologies to accelerate time to market. Before joining Alphawave, Letizia was an IP product line manager at Intel, enabling interface IP for external customers as well as Intel graphics and CPU products. She has also held technical engineering positions at STMicroelectronics with a strong focus on technical marketing, ASIC design, testing, DFT, and failure analysis. Letizia earned an MSEE from Politecnico di Milano. She is a contributor to the OpenHBI specification for a laminate substrate (Open Compute Project). |
Partner with us |
List your ProductsSuppliers, list and add your products for free. |
More about D&R Privacy Policy© 2024 Design And Reuse All Rights Reserved. No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse. |
||||||
This website uses cookies to store information on your computer/device.
By continuing to use our site, you consent to our cookies.
Please see our Privacy Policy to learn more about how we use cookies and how to change your settings if you do not want cookies on your computer/device.