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Day 1 - December 1st, 2021
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9 am CET
Welcome
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Gabriele Saucier
CEO
Design And Reuse
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Entering D&R 25th year: a Quarter of a century of IP business
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9.30 am CET
Towards a Green world
Chairperson: Gabriele Saucier - Design And Reuse
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Francois Brunier
Partnership Program Manager
Soitec
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FDSOI:The European technology for the digital and green transition
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Patrick Blouet
Collaborative Program Manager
STMicroelectronics
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Toward Green ECS: a real challenge for Europe
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10.15 am CET
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Panel: "Towards a sustainable semiconductor industry"
Organized by Philippe Flatresse, Soitec
The world is changing, setting up unprecedented challenges in terms of efficiency and sustainability. Ecodesign is becoming a must have in our industry, aiming to be efficient by controlling and minimizing the environmental impact of new technologies.
With the participation of:
- Lea Di CIOCCIO - Scientific Advisor - CEA
- Patrick Blouet - Collaborative Program Manager - STMicroelectronics
- Christophe Girard - Technology Director - SOITEC
- John FISKE - Business Development Manager - ASCA Sensor / IoT
With the participation of:
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Lea Di CIOCCIO - Scientific Advisor - CEA
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Patrick Blouet - Collaborative Program Manager - STMicroelectronics
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Christophe Girard - Technology Director - SOITEC
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John FISKE - Business Development Manager - ASCA Sensor / IoT
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Break
11.30 am CET
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11.45 am CET
IP Design and Verification
Chairperson: Ahmed Jerraya - CEA LETI
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Ilya Temnikov
Principal EDA Engineer
Thalia
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A comprehensive new solution to IP Development and Reuse - Circuits to ESDs
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Priyanka Singh
Senior Engineer
eInfochips, Inc.
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Accelerating Functional Coverage Generation Using AI
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Nina Spasojevic
Marketing Manager
HDL Design House
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Design and Verify With Confidence with HDL Design House ARM Expertise
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Lunch
1 pm CET
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2 pm CET
ESD and Data Converters
Chairperson: Philippe Flatresse - Soitec
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Thomas Ako
Business Development
Sofics
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How to choose custom ESD IP for your next IC
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Ken Potts
Chief Operating Officer
Alphacore, Inc.
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High speed, low power hybrid ADC for direct to RF sampling applications.
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Manar El-Chammas
VP Engineering
Omni Design Technologies, Inc.
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Use of High-Speed Data Converters to Enable Automotive and 5G Applications
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Break
3 pm CET
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3.15 pm CET
Connectivity & Interfaces
Chairperson: Philippe Quinio - STMicroelectronics
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Olivier Mazuyer
Regional Sales Manager
Ceva, Inc.
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UWB - Challenges and solution of this reborn standard
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Manish Kumar Pandey
Sr. ASIC Digital Design Engineer
Synopsys, Inc.
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Optimal SMBus System Topology with Multiple Slaves in One Physical Instance
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Yaron Semiat
Product Owner
Arteris IP
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Automating Hardware-Software Interface (HSI) Creation Using NoC Interconnect and IP Deployment Technology
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Break
4.15 pm CET
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4.30 pm CET
Interface IP
Chairperson: Nicolas Gaude - Dolphin Design
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Priyank Shukla
Sr. Staff Product Marketing Manager
Synopsys, Inc.
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Saving Power for High-Performance Computing - One Interface at a Time
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Rajal Jamvecha
Engineer
eInfochips, Inc.
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Low Power Sub State Management in PCIe LTSSM
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Tony Pialis
CEO & President
Alphawave Semi
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Powering the Data Explosion
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Ashraf Takla
Founder & CEO
Mixel, Inc.
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MIPI D-PHY and MIPI CSI-2 for IoT: AI Edge Devices
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Break
6 pm CET
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6.15 pm CET
Memory IP
Chairperson: Philippe Flatresse - Soitec
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Christopher Neil Brown
Senior Manager - SST IP & Technology
Microchip SST
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memBrain - the "in memory compute" IP for AI devices
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Frank Ferro
Sr Dir Product Marketing
Rambus, Inc.
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Selecting the Right High Bandwidth Memory
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Dinner
7.30 pm CET
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