Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity - Dec. 20, 2024Enabling the Industry’s First 64 Gbps UCIe IPs following the Successful Tapeout of Alphawave Semi’s Gen2 36 Gbps UCIe IP on TSMC’s 3nm Technology, supporting both High-Y... > Read Chiplet Summit Features the Latest Chip Design Technology - Dec. 17, 2024SAN DIEGO--(BUSINESS WIRE)--Chiplet Summit's 2025 event offers the last word on leading-edge chip design at the Santa Clara Convention Center on January 21-23. The Tuesday tutorials cove... > Read |
Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition - Dec. 20, 2024-- Today, Synopsys issued the following statement in response to the U.K. Competition and Markets Authority's (CMA) recently published Phase 1 findings regarding Synopsys' proposed acquisitio... > Read Third day for Arm vs Qualcomm trial - Dec. 19, 2024Yesterday – the third day of the Arm vs Qualcomm court case in Wilmington, Delaware – saw Qualcomm CEO Cristiano Amon giving evidence. By David Manners, ElectronicsWeekly (De... > Read ARM versus Qualcomm court case opens - Dec. 18, 2024By Peter Clarke, eenews Europe (December 17, 2024) The ARM versus Qualcomm court hearing began Monday with opening statements as the licensor-licensee partners argue over Qualcomm’s... > Read |
Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU - Dec. 20, 2024By Sally Ward-Foxton, EETimes (December 20, 2024) Munich, GERMANY — As part of its transition back to a pure-play IP company, Ceva officially launched its NeuPro-Nano earlier this y... > Read RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models - Dec. 19, 2024The model, launched by Abu Dhabi’s Technology Innovation Institute (TII), runs seamlessly in RaiderChip’s AI accelerator and its FPGA based demonstrator. -- On December 17th,... > Read |
Enhancements to Creonic's DVB-S2X IP Cores for Greater Flexibility and Performance - Dec. 19, 2024Kaiserslautern, Germany, December 19, 2024 - Creonic GmbH, the leading provider of cutting-edge communications IP cores, announces valuable enhancements to the DVB-S2X IP core portfolio, spe... > Read |
VeriSilicon unveils next-generation high-performance Vitality architecture GPU IP series - Dec. 19, 2024Empowering efficient cloud gaming with DirectX 12 support and advanced computing capabilities --VeriSilicon (688521.SH) today announced the launch of its latest Vitality architecture Graphi... > Read |
Samsung Reportedly Considering Partnership with TSMC to Jointly Produce Exynos 2500 - Dec. 18, 2024According to a report from Wccftech, Samsung Electronics may consider partnering with external foundries to produce its Exynos 2500 processor for the first time. The Wccftech report, citing ... > Read Samsung and TSMC locked in intense 2nm chip competition - Dec. 16, 2024TSMC kicks off 2nm trial production in April while Samsung targets early next year Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC) are locked in a fierce competition... > Read |
Crypto Quantique adds TRNG to its quantum-derived, side-channel protected PUF hardware IP block - Dec. 18, 2024London -- December 18, 2024 -- Crypto Quantique, a provider of quantum-driven security for the Internet of Things (IoT), has boosted the functionality of its semiconductor hardware security ... > Read Powering the NVM and Embedded Chip Security Technologies - Dec. 12, 2024eMemory’s Michael Ho discusses how the company is addressing the memory and security challenges in high-performance computing applications. By Stephen Las Marias, EE Times Asia In... > Read |
Andes Technology Partners with ProvenRun to Strengthen RISC-V Trusted Execution Environment - Dec. 18, 2024– Andes Technology Corporation (TWSE: 6533), the leading supplier of RISC-V processor IP, and ProvenRun, the leading secure OS vendor for connected vehicles and smart devices, announc... > Read Jmem Tek and Andes Technology Partner on the World' s First Quantum-Secure RISC-V Chip - Dec. 11, 2024Hsinchu, Taiwan – Dec 11, 2024 – Jmem Tek, a specialist in hardware security and post-quantum cryptography for IoT devices, announces a global partnership with Andes Technology... > Read UPMEM selects Semidynamics RISC-V AI IP for Large Language Model Application - Dec. 09, 2024Barcelona, Spain – December 9, 2024 -- Semidynamics, the leading IP company for high performance, AI-enabled, RISC-V processors, is happy to announce that UPMEM has selected Semidynam... > Read |
Reimagining Video Excellence at CES 2025 with intoPIX - Dec. 18, 2024Elevate your video performance with intoPIX low-power & low-latency compression solutions The demand for higher image quality, lower latency, and greater efficiency drives innovation i... > Read BBright Expands Ultra HD Capabilities with intoPIX JPEG XS Technology in its V2.2 Decoder Platform - Dec. 12, 2024Bringing Flexibility and Scalability to Ultra HD Broadcasts with intoPIX JPEG XS intoPIX is pleased to expand its collaboration with BBright by enhancing the V2.2 Decoder platfor... > Read |
M31 Unveils Full Range of Automotive IP Solutions at ICCAD Illuminating the Future of Automotive Chip Development - Dec. 17, 2024-- M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), made a significant appearance at the 2024 China Integrated Circuit Design Industry Exhib... > Read Synopsys and SiMa.ai Announce Strategic Collaboration to Accelerate Development of Automotive Edge AI Solutions - Dec. 17, 2024Joint Solution to Speed SoC Development for Next-generation ADAS and IVI Applications -- Synopsys and SiMa.ai today announced a strategic collaboration to jointly deliver a new solutio... > Read |
sureCore teams with Sarcina to package cryo chips - Dec. 17, 2024-- Further to sureCore’s recent announcement about its launch of a range of cryogenic IP following the successful evaluation of test chips in both 180 nm and 22nm process nodes, the c... > Read MosChip selects Cadence tools for the design of HPC Processor "AUM" for C-DAC - Dec. 12, 2024— MosChip® Technologies selects Cadence 5nm EDA tools for the design of the High-Performance Computing (HPC) Processor “AUM” for C-DAC. MosChip® Technologies ... > Read |
Nordic's Thingy prototypes IoT products - Dec. 11, 2024Nordic Semiconductor is shipping its latest IoT prototyping platform, the Nordic Thingy:91 X, for LTE-M, NB-IoT, Wi-Fi SSID locationing, DECT NR+, and GNSS applications. The Thingy:91 X sim... > Read |
Comprehensive ADC/DAC and AFE IP Solutions: Enabling Next-Generation Applications Across Varying Technology Nodes - Dec. 10, 2024– T2M IP, a global leader in Analog IP solutions, proudly announces the launch of its partner's cutting-edge Analog-to-Digital Converter (ADC), Digital-to-Analog Converter (DAC), and ... > Read Sondrel now shipping chips as part of a complete turnkey project - Dec. 09, 2024Sondrel has announced that it is now shipping finished chips to a US customer as part of a full turnkey contract of concept to silicon. The chips are accelerators for AI, which is one of Sond... > Read Arasan Announces immediate availability of its SPMI IP (System Power Management Interface) - Dec. 09, 2024Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, today announced the immediate availability of its MIPI SPMI IP Dec 9, 2024, San Jose, CA -- Aras... > Read |