Interconnect, D2D, C2C IP Catalog

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Interconnect, D2D, C2C IP Catalog

Chip to Chip (4)

Die-to-die (29)

Intra SoC Connectivity (10)

Network Interconnect (15)

1

16G UCIe Advanced PHY for TSMC 3nm

UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance bandwidth for die-to-die link interconnectivity

2

16G UCIe Standard PHY for TSMC 3nm

UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance bandwidth for die-to-die link interconnectivity

3

16G UCIe Standard PHY for TSMC 7nm

UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance bandwidth for die-to-die link interconnectivity

4

2-16Gbps Die-to-Die (D2D) Multi-Protocol IO Supporting BOW, OHBI and UCIe

AresCORE is a market leading extremely low-power, low-latency interface IP designed by Alphawave IP for very high bandwidth connections between two dies that are on the same package.

5

25-112Gbps Extra Short-Reach (XSR) Multi-Standard SerDes (MSS)

The Alphawave DieCORE delivers the world s highest density, lowest power die-to-die connectivity solution for MCMs based on OIF XSR/USR serial standards. The DieCORE is a companion IP to the AlphaCOR...

6

40G Ultralink D2D PHY for GF12LP+

Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

7

40G Ultralink D2D PHY for Samsung 7LPP

Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

8

40G Ultralink D2D PHY for TSMC 3nm

Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

9

40G Ultralink D2D PHY for TSMC 5nm

Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

10

40G Ultralink D2D PHY for TSMC 7nm

Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

11

D2D PHY (Die-to-Die Interface)

Die-to-Die (D2D) PHY IP is based on HBM electrical specification and will also be compatible with upcoming interface standards. It is used specifically for heterogenous chiplet solutions in wired comm...

12

D2D Controller IP (Die-to-Die Interface)

OpenFive s Die-to-Die (D2D) Controller IP is targeted for heterogenous chiplet solutions in wired communications, AI and HPC applications. With recent advances in package technologies, it is possible ...

13

DesignWare Die-to-Die Controller IP with AXI Interface

The DesignWare Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accelerator, networking and high-performance computing...

14

DesignWare Die-to-Die Controller IP with AXI Interface

The DesignWare Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accelerator, networking and high-performance comput...

15

DesignWare Die-to-Die PHY IP in TSMC N7 Process

The DesignWare Die-to-Die PHY IP enables high-bandwidth ultra and extra short reach interfaces in multi-chip modules (MCMs) for hyperscale data center, AI, and networking applications. The low-latency...

16

Universal Chiplet Interconnect Express (UCIe 1.0) Controller

Ultra-low latency UCIe controller for standard industry chiplet interoperability on streaming, PCIe, and CXL protocols

17

Mobiveil RapidIO Controller (GRIO)

Generic RapidIO (GRIO) controller is a highly flexible and configurable IP to provide RapidIO interface on one side and a generic interface on the system side.

18

1-56/112G Multi-protocol Serdes (Interlaken, JESD204, CPRI, Ethernet, OIF/CEI)

eTopus designs ultra-high speed mixed-signal semiconductor IP solutions for high-performance computing and data center applications. Our 1-56/112Gbps ultra-high speed SerDes IP is adopted by global Ti...

19

1-56G-PCIe Gen5 ePHY Multi-Protocol SerDes IP - 7nm Low Power and Latency

Ultra-high speed SerDes IP, adopted by global Tier-1 network/storage/5G OEMs and major semiconductor companies. eTopus is the pioneer on PAN4 ADC/DSP-based SerDes, the first startup demonstrated 56Gb...

20

CodaCache Last Level Cache IP

CodaCache is a configurable, standalone, non-coherent cache IP that delivers unique business value through its advanced last-level cache (LLC) architecture, improving system performance, data locality...

21

FlexNoC 5 Network-on-Chip (NoC)

Arteris FlexNoC 5 network-on-chip (NoC) physically aware interconnect IP improves development time, performance, power consumption, and die size of system-on-chip (SoC) devices for mobile, automotive,...

22

FlexNoC 5 Option For Scalability and Performance Critical Systems

Arteris IP FlexNoC Performance Option accelerates development of next-generation deep neural network (DNN) and machine learning systems. Automate and optimize the networks while efficiently implementi...

23

FlexNoC Resilience Package

The Arteris FlexNoC Resilience Package provides hardware-based data protection for increased SoC reliability and functional safety.

24

FlexWay Interconnect IP

FlexWay 5 from Arteris is an essential entry-level IP generator for cost-efficient, high-performance network-on-chip (NoC) designs. It revolutionizes SoC development with optimized interconnects, r...

25

High speed NoC (Network On-Chip) Interconnect IP

OPENEDGES is the only total memory system IP company providing both memory controller and on-chip interconnect. OIC is the ORBIT high-speed On-chip Interconnect, which delivers exceptional performance...

26

Innovative Ultra-High-Speed Chiplet Solution

Innosilicon INNOLINK™ IP provides a leading-edge chiplet solution allowing massive amounts of low-latency data to pass seamlessly between smaller chips as if they were all on the same bus. Chiplets, d...

27

Multi-Die interLink (GLink 2.3) IP

GUC multi-die interLink (GLink) IP provides world’s best class solution for high-bandwidth, low-power, low-latency multi-channel interconnection in a package for applications such as High Performance ...

28

Ncore 3 Coherent Network-on-Chip (NoC)

For scalable and area-efficient heterogeneous cache coherent systems. The Arteris Ncore Cache Coherent Interconnect IP offers unparalleled scalability, configurability, and, with the Ncore Safety Opt...

29

Ncore 3 Coherent Network-on-Chip (NoC)

For scalable and area-efficient heterogeneous cache coherent systems.

30

TSMC CLN6FF/7FF Die-to-Die Interface PHY

IGAD2DX01A is a high speed die-to-die interface PHY which transmits data through INFO RDL channels. IGAD2DX01A contains 32 Tx lanes and 32 Rx lanes per slice and supports 8 slices in one PHY. Each Tx/...

31

Analog I/O + ESD protection for Die-2-die interfaces

Analog I/OS and power line ESD solutions All voltage domains (0.75V to 5V) Additional voltage (e.g. 12V in 28nm proven)

32

Scatter-Gather DMA - AXI4-Stream to/from AXI4 Memory Map Transfers

The Digital Blocks DB-DMAC-MC-AXI4-MM-STREAM Verilog RTL IP Core is a Multi-Channel Scatter-Gather DMA Controller that transfers data between AXI4 Memory Map and AXI4-Stream Interfaces.

33

2GBps Low Power D2D Interface

Custom die-to-die high-speed interface in 28nm process technology. The I/O cells are defined as TX only, and RX only, and have two modes of operation, standard full rail to swing, or a custom low nois...

34

5/10/40G Ultra Low Latency MAC PCS with AXI-4 and UCIe support

This IP is optimized for AI/ML workloads and lowest possible latency.

It is not meant to be a generic 1G to 10G MAC – it only supports 5G and 10G operation.

35

600MBps Low Power D2D Interface in 16nm

Custom die-to-die interface in 16nm process technology. The I/O cell is bi-directional and has two modes of operation: standard rail-to-rail swing or a custom low-noise pseudo-differential interface. ...

36

BlueLynx Executable Generator Technology

BlueLynx™ technology revolutionizes the game in silicon design and engineering. Using proprietary technology, Blue Cheetah eliminates inefficiencies inherent in traditional silicon design processes while maintaining complete integrity.

37

Bunch of Wires [BoW] PHY IP

Blue Cheetah's Bunch of Wires [BoW] PHY IP design incorporates the maximum benefit of the Open Compute Project's (OCP) inter-chiplet PHY specification, targeting best in class power, performa...

38

Coherent Network-on-Chip (NOC)

Scalable and area efficient interconnect solution optimized for memory coherent systems

39

Coherent Network-on-chip (NoC) IP

C-NoC is a layered, scalable, configurable, and physically aware configurable NoC. It supports mesh, grid and torus topologies with simultaneous existence of both coherent and non-coherent traffic. It...

40

Coherent Network-on-chip (NoC) IP

C-NoC is a layered, scalable, configurable, and physically aware configurable NoC. It supports mesh, grid and torus topologies with simultaneous existence of both coherent and non-coherent traffic. It...

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