GUC Leverages 3DIC Compiler to Enable 2.5D/3D Multi-Die Package
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Interconnect, D2D, C2C

  Movellus Introduces Aeonic Power™ Product Family for On-Die Voltage Regulation - Jun. 19, 2024 ❖

-- Movellus today announced the introduction of the Aeonic Power™ product family aimed at meeting the on-die power delivery needs of computational blocks, functional blocks, and die-t...  > Read

  Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infra... - Jun. 13, 2024 ❖

Power-efficient, off-the-shelf chiplet on TSMC 7nm process offers high-performance 1.6 Tbps throughput, ease of integration and reduced development time - Alphawave Semi (LSE: AWE), a glo...  > Read

Artificial Intelligence

  YorChip announces Low Latency 200G Chiplet for edge AI - Jun. 19, 2024 ❖

YorChip Chiplet supports both Advanced and Standard UCIe packaging options and features 4 x 56G Long Reach PHY for a total bandwidth of 200Gbps. -- YorChip, Inc. announces its first Chiple...  > Read

  SEMIFIVE joins Arm Total Design with plans to develop Arm Neoverse-powered HPC Platform - Jun. 12, 2024 ❖

The HPC platform to be built on Samsung SF4X with LPDDR6 Memory Interface — SEMIFIVE, a leading SoC design platform, announced today it has joined Arm Total Design and will begin ...  > Read

Automotive - Avionics

  Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024 - Jun. 19, 2024 ❖

Cadence verification and RTL-to-GDS digital full-flow tuned for automotive safety, quality and reliability requirements -- At embedded world 2024, Cadence and Dream Chip demonstrated Dream...  > Read

  Faraday to Exhibit Next-gen ASIC Solutions at DAC 2024 - Jun. 18, 2024 ❖

-- Faraday Technology Corporation, a leading ASIC design service and IP provider, will exhibit at the Design Automation Conference (DAC) on June 24-26, 2024, in San Francisco, CA, USA. Farad...  > Read

Business News

  Sequans Announces a New $15 Million Licensing Agreement - Jun. 18, 2024 ❖

Reinforcing Licensing Business Strategy PARIS, France — June 18, 2024 — Sequans Communications S.A. (NYSE: SQNS), a leading developer and provider of 5G/4G semiconductors an...  > Read

  Sondrel secures major funding today - Jun. 13, 2024 ❖

Sondrel (AIM: SND), a leading provider of ultra-complex chips for leading global technology brands, has announced a major investment of £5.6 million by ROX Equity Partners Limited, a UK-...  > Read

  Silvaco Announces Initiatives to Enhance Workforce Development in Semiconductor Industry - Jun. 12, 2024 ❖

Silvaco Group, Inc. (Nasdaq: SVCO, "Silvaco"), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and digital twin modeling through AI software and...  > Read

Foundry and Technology News

  QuickLogic Joins Intel Foundry Accelerator IP and USMAG Alliance Programs - Jun. 18, 2024 ❖

-- QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, ruggedized FPGAs and endpoint AI solutions, announced today it has joined Intel Foundry's Accelerator ...  > Read

  Synopsys Achieves Certification of its AI-driven Digital and Analog Flows and IP on Samsung Advanced SF2 GAA Process - Jun. 13, 2024 ❖

Production-Ready Design Flows, Multi-Die Solution, and Synopsys IP Deliver a Proven Path to Unparalleled Power and Performance for AI and HPC Designs -- Synopsys, Inc. (Nasdaq: SNPS ) t...  > Read

RISC-V Ecosystem

  Initial members join CHERI Alliance to drive adoption of memory safety and scalable software compartmentalization - Jun 17, 2024 ❖

Founding members include Capabilities Limited, Codasip, the FreeBSD Foundation, lowRISC, SCI Semiconductor, and the University of Cambridge — The CHERI Alliance CIC (Community Interest...  > Read

  Codasip Claims 'Best-in-Class' RISC-V Core for Power-Conscious Designs - Jun. 15, 2024 ❖

The L110 embedded RISC-V processor core is highly configurable using the new Codasip Studio Fusion design automation toolset. Munich-based Codasip, a leading vendor of RISC-V processor soluti...  > Read

  Axiomise Heads to RISC-V Summit Europe June 25-27 in Munich - Jun. 13, 2024 ❖

Demonstrates formalISA RISC-V App Showcases production-grade verification methodology Offers discount pricing for On-Demand FV101 Course through mid-July LONDON, June 13, 2024...  > Read

5G - Network - Wireless

  Imec unveils CMOS-based 56Gb/s zero-IF D-band beamforming transmitter, featuring superior output power and energy efficiency - Jun. 17, 2024 ❖

Designed to support next-generation, short-range, high-speed wireless services at frequencies above 100GHz - from wireless fail-safes in data centers to extended reality (XR) solutions At thi...  > Read

Security Solutions

  Consortium led by Crosshill Oy signs defense technology development agreement for F-35 Program with Lockheed Martin - Jun. 13, 2024 ❖

-- The members of the consortium led by Tampere-based Crosshill Oy have signed an indirect industrial cooperation agreement with Lockheed Martin related to the F-35 program in Finland. The p...  > Read

  Nuvoton Develops OpenTitan® based Security Chip as Next Gen Security Solution for Chromebooks - Jun 07, 2024 ❖

Nuvoton Technology Corporation , a global leader in embedded controller and secure IC solutions, announced today that Google’s ChromeOS plans to use the first commercial chip built on ...  > Read

Embedded Processing

  Flow Computing Emerges from Stealth with Licensable, On-Die Parallel Processing Enabling 100X Improved Performance For Any... - Jun. 13, 2024 ❖

June 13, 2024 – Helsinki – Flow Computing Oy - the pioneer in licensing on-die ultra-high-performance parallel computing solutions to CPU vendors of all architectures – ...  > Read

SoC Design Platforms and Services

  Alphawave Semi to Showcase Next-Generation PCIe® 7.0 IP Platform for High-Performance Connectivity and Compute at PCI-SIG®... - Jun. 12, 2024 ❖

Participation at Santa Clara event includes industry leading demonstrations covering 128 Gbps PCIe 7.0 and PCI 6.0 specification interoperability over optics and copper cables Alphawave...  > Read

  Sondrel offers leading edge chip design teams - Jun. 10, 2024 ❖

UK design house Sondrel is offering customers a solution to their shortage of engineers in the form of its Outsourced Design Team (ODT) service. Sondrel CEO steps down as chip firm face...  > Read

Audio, Voice, Video

  intoPIX Launches Titanium at InfoComm, Boosting professional AV-over-IP Workflow Efficiency - Jun 10, 2024 ❖

intoPIX , the leading provider of low-latency, lightweight JPEG XS technologies and solutions, is thrilled to announce the release of TITANIUM. This groundbreaking range of solutions empowers ...  > Read

FPGA World

  eXpreso eFPGA Compiler Achieves 98.6% Packing Density - Jun 10, 2024 ❖

Up to 1.5x higher Fmax, 2x packing density, and 10x faster compile time – Flex Logix® Technologies, Inc ., the leading supplier of embedded FPGA (eFPGA) IP and reconfigurable DS...  > Read

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