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- December 10^th-11^th, 2024 Submission Open >>

Silvaco's Fab Technology Co-Optimization (FTCO): From Atoms to Systems

**NIST Releases First 3 Finalized Post-Quantum Encryption Standards - Sept. 13, 2024 ❖**

NIST has released a final set of encryption tools designed to withstand the attack of a quantum computer. These post-quantum encryption standards secure a wide range of electronic informa... > Read

**Xiphera Develops Quantum-Resilient Hardware Security Solutions for Space - Sep 10, 2024 ❖**

Quantum-resilient Authenticated Boot and Hardware Root of Trust solutions bring future-proof security to space infrastructures. -- Xiphera, Ltd, a Finnish company designing and implementing ... > Read

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Foundry and Technology News

**Samsung's 2nm Yield Rate at Most 20%, Withdraws Personnel from Texas Taylor Plant - Sept. 12, 2024 ❖**

While Samsung Electronics is said to be delivering an oversea workforce cut up to 30%, a report from Korean media outlet Business Korea on September 11th has added that persistent issues with... > Read

**Samsung Partners with TSMC, Its Foundry Rival, on HBM4 Development - Sept. 06, 2024 ❖**

No eternal allies. No perpetual enemies. The old proverb seems so true when it comes to the semiconductor industry, when the world's top foundry, TSMC, announced the collaboration with its... > Read

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Business News

**TSMC August 2024 Revenue Report - Sep 10, 2024 ❖**

TSMC (TWSE: 2330, NYSE: TSM) today announced its net revenue for July 2024: On a consolidated basis, revenue for July 2024 was approximately NT$256.95 billion, an increase of 23.6 percent from... > Read

**Qualitas Semiconductor Enters into Landmark the World's 1st 2nm MIPI DCPHY Licensing Agreement with Leading U.S. Fabless C... - Sep 09, 2024 ❖**

SEOUL, South Korea – September 9, 2024 – Qualitas Semiconductor Co., Ltd. (hereinafter referred to as QUALITAS) (KOSDAQ: 432720), a leading provider in high-speed interface IP, a... > Read

**SMIC cuts capex and R&D - Sept. 09, 2024 ❖**

China’s leading foundry, SMIC, has been cutting capex and R&D despite soaring imports of chip manufacturing equipment into China. By David Manners, ElectronicsWeekly (September ... > Read

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AI Products

Artificial Intelligence

**China wants to challenge the U.S. in AI – here's what Chinese giants are doing with the tech - Sept. 11, 2024 ❖**

Global attention around generative artificial intelligence has been focused on big U.S. companies like OpenAI, Alphabet's Google and Meta But some of China's giants, from Alibaba ... > Read

**Sondrel announces Advanced Modelling Process for AI chip designs - Sep 10, 2024 ❖**

Sondrel, a leading provider of ultra-complex custom chips for leading global technology brands, has announced an Advanced Modelling Process for AI chip designs. This runs through every stage o... > Read

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View Products

Interconnect, D2D, C2C

**Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets - Sep 10, 2024 ❖**

-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its advanced packaging coordinated platform for the vertical disintegration of c... > Read

**Synopsys Powers World's Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps - Sep 10, 2024 ❖**

Complete Synopsys 40G UCIe IP Solution Delivers Maximum Bandwidth for Die-to-Die Connectivity in High-Performance AI Data Center Chips – Synopsys, Inc. (Nasdaq: SNPS ) today announ... > Read

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Automotive IP

Automotive - Avionics

**BrainChip Identifies Advantages to Radar and Lidar Systems Leveraging Event-Based AI - Sep 10, 2024 ❖**

– Developers of radar and lidar systems have a new option in addressing key detection and tracking challenges by utilizing event-based AI computing architectures that provide performance... > Read

**SiliconAuto adopts Siemens' PAVE360 to accelerate pre-silicon ADAS SoC development - Sept. 04, 2024 ❖**

September 4, 2024 - Plano, Texas, USA -- Siemens Digital Industries Software announced today that SiliconAuto has adopted PAVE360™ software to help reduce development time for its ran... > Read

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View IP

Audio, Voice, Video

**intoPIX and BCnexxt Join Forces to Revolutionize Live Playout with JPEG XS Technology - Sep 10, 2024 ❖**

Enhancing Broadcast Efficiency and Quality with Real-Time, Low-Latency HD Stream Decoding – intoPIX , the leading expert in innovative video compression solutions, is proud to announc... > Read

**T2M IP Unveils Advanced H.264 and H.265 HEVC Codec IP Cores for High-Efficiency Video Solutions - Sept. 09, 2024 ❖**

T2M IP , a leading provider of semiconductor IP cores, proudly announces the immediate availability of their partner's H.264 and H.265 HEVC Codec IP cores. These state-of-the-art solutions ar... > Read

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RISC-V

RISC-V Ecosystem

**SEALSQ Adopts RISC-V the Open-Standard RISC-V Architecture; Achievement Aligns with Rising Global Demand for Edge-AI and M... - Sept. 13, 2024 ❖**

Geneva, Switzerland, Sept. 13, 2024 (GLOBE NEWSWIRE) SEALSQ Corp (NASDAQ: LAES) ("SEALSQ" or "Company"), a company that focuses on developing and selling Semiconductors, PKI and Post-Quantum... > Read

**Semidynamics on major recruitment drive for RISC-V software engineers - Sept. 09, 2024 ❖**

Also recruiting for engineers to produce test chips Barcelona, Spain – September 9, 2024. Semidynamics, the European RISC-V custom core AI specialist, is on a major recruitment driv... > Read

**Advancing AI the Brazilian Way: Fostering Innovation Through Collaboration and Open Standards - Sept. 09, 2024 ❖**

Brazil is making significant strides in developing artificial intelligence (AI) infrastructure, focusing primarily on High-Performance Computing (HPC), semiconductor technology, and large la... > Read

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IoT IP

Internet of Things

**CoreHW and Presto Engineering Announce Ground-breaking Collaboration to Advance Global Penetration of Ultra-low-power RF I... - Sept. 03, 2024 ❖**

CoreHW, a prominent fabless semiconductor company, and Presto Engineering, a European leader in application-specific integrated circuit (ASIC) design, engineering, and production services, h... > Read

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Industry Articles

**NIST Releases First 3 Finalized Post-Quantum Encryption Standards - Sept. 13, 2024 ❖**

**Xiphera Develops Quantum-Resilient Hardware Security Solutions for Space - Sep 10, 2024 ❖**

**Samsung's 2nm Yield Rate at Most 20%, Withdraws Personnel from Texas Taylor Plant - Sept. 12, 2024 ❖**

**Samsung Partners with TSMC, Its Foundry Rival, on HBM4 Development - Sept. 06, 2024 ❖**

**TSMC August 2024 Revenue Report - Sep 10, 2024 ❖**

**Qualitas Semiconductor Enters into Landmark the World's 1st 2nm MIPI DCPHY Licensing Agreement with Leading U.S. Fabless C... - Sep 09, 2024 ❖**

**SMIC cuts capex and R&D - Sept. 09, 2024 ❖**

**China wants to challenge the U.S. in AI – here's what Chinese giants are doing with the tech - Sept. 11, 2024 ❖**

**Sondrel announces Advanced Modelling Process for AI chip designs - Sep 10, 2024 ❖**

**Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets - Sep 10, 2024 ❖**

**Synopsys Powers World's Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps - Sep 10, 2024 ❖**

**BrainChip Identifies Advantages to Radar and Lidar Systems Leveraging Event-Based AI - Sep 10, 2024 ❖**

**SiliconAuto adopts Siemens' PAVE360 to accelerate pre-silicon ADAS SoC development - Sept. 04, 2024 ❖**

**intoPIX and BCnexxt Join Forces to Revolutionize Live Playout with JPEG XS Technology - Sep 10, 2024 ❖**

**T2M IP Unveils Advanced H.264 and H.265 HEVC Codec IP Cores for High-Efficiency Video Solutions - Sept. 09, 2024 ❖**

**SEALSQ Adopts RISC-V the Open-Standard RISC-V Architecture; Achievement Aligns with Rising Global Demand for Edge-AI and M... - Sept. 13, 2024 ❖**

**Semidynamics on major recruitment drive for RISC-V software engineers - Sept. 09, 2024 ❖**

**Advancing AI the Brazilian Way: Fostering Innovation Through Collaboration and Open Standards - Sept. 09, 2024 ❖**

**CoreHW and Presto Engineering Announce Ground-breaking Collaboration to Advance Global Penetration of Ultra-low-power RF I... - Sept. 03, 2024 ❖**